Nano-Enabled Conducting Materials Accelerating Device Applicability

Supporting high speed roll to roll integration of hybrid and large area electronics

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Supporting the Internet of Things

Developing advanced functional materials to deliver customised conductive inks and flexible adhesives, compatible with volume manufacture of hybrid and large area electronics.

These new and novel manufacturing processes will support the ‘Internet of Things’ (IoT) opportunities, initially within the packaging, healthcare and home appliance sectors.

The Fraunhofer Institute for Building Physics is widely recognised as a global expert in the development and implementation of life cycle studies. Within the Necomada project, Fraunhofer IBP will support the development of the end-user case-studies, but importantly, also focus on the LCA and Regulatory Affairs element of developing a pilot line service.

Fraunhofer IBP will timely provide R&D support to project partners – especially relevant with regards the development of a long-term & sustainable pilot line offering.

Fraunhofer Institute for Building Physics View All partners