Nano-Enabled Conducting Materials Accelerating Device Applicability
Supporting high speed roll to roll integration of hybrid and large area electronics
Supporting the Internet of Things
Developing advanced functional materials to deliver customised conductive inks and flexible adhesives, compatible with volume manufacture of hybrid and large area electronics.
These new and novel manufacturing processes will support the ‘Internet of Things’ (IoT) opportunities, initially within the packaging, healthcare and home appliance sectors.
Our project teams – encompassing The National Formulations Centre and The National Printable Electronics Centre – are working hand-in-hand with our project partners to develop not only novel inks and adhesives, but offer a Roll-to-Roll integration services for hybrid and printed electronics applciations.
The unique blend of CPI’s scientific knowledge, engineering know-how, combined with wide-ranging R2R asset base, presents a unique opportunity for the Necomada consortium. Developments during the course of the project will be profound, developing solutions across a range of case study products, incorporating both printed and hybrid technologies, taking the much vaunted ‘Internet of Things’ (IoT) opportunities to the next level, providing an enduring pilot line service.
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