Necomada is a three year project, from 1 January 2017 to 31 December 2019.
The project is developing advanced functional materials to deliver customised conductive inks and flexible adhesives, compatible with volume manufacture of hybrid and large area electronics.
Through collaboration with partner organisations across Europe, the project addresses key material challenges inherent in realising of the ‘Internet of Things’ (IoT).
The development of these new and novel manufacturing processes will support IoT opportunities initially within the packaging, healthcare and home appliance sectors.
The project’s ultimate aim is to use this line as an open access facility for commercial use.