The overall NECOMADA objective is the delivery of conductive inks and adhesives compatible with Roll to Roll (R2R) application on flexible substrates via a pilot line featuring high speed printing and/or pick and place conversion.
Such printed flexible electronics will enable manufacture of inter alia devices for Machine to Machine Communication devices such as Near Field Communications (NFC) and Radio-Frequency Identification (RFID).
The project targets substantial reduction in device costs (greater than an order of magnitude) compared with current State of the Art (SoA). This will be achieved through the combination of formulated structured nanomaterials (conductive inks/ adhesives) together with R2R printing, coating and component pick & place to demonstrate at pilot scale the potential for low cost, robust, high volume device manufacture.
The NECOMADA pilot line vision will:
1. Integrate, develop and optimise the materials set required to print advanced functional materials (flexible and hybrid electronics) conveying customised thermal and electrical properties.
2. Specifically develop a new set of multi-functional nano-enabled electrically conductive adhesives and printable conductor inks suitable for upscale R2R manufacture.
3. Develop integrated print and assembly capabilities which enable the use of the materials set in a pilot scale environment.
4. Industrially validate robust and repeatable production methods for reliable delivery of product.
5. Validate market performance of the targeted devices (NFC and RFID) with established industry leaders cross sector.
6. Deliver a fully exploitable and reconfigurable open access materials development & integration platform (PILOT LINE) which is economically sustainable in the long term.
7. Co-develop sustainable life cycle strategies with regard to the circular economy, production management and occupational and environmental exposure.
8. Create future EU supply chains: exploiting new materials to meet the challenging technical and commercial requirements of increasing throughput and speed whilst reducing costs.