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NECOMADA project presents at CPI event, showcasing opportunities in smart packaging

NECOMADA project presents at CPI event, showcasing opportunities in smart packaging

Necomada Project Update – August 2018

New Ink and Adhesive Formulations to Reduce Cost of Internet of Things

New Ink and Adhesive Formulations to Reduce Cost of Internet of Things

European collaboration to include everyday items in the Internet of Things

European collaboration to include everyday items in the Internet of Things