Companies, researchers and network partners discovered the latest developments in IoT enabled technology at CPI’s event in Darlington to showcase the opportunities in smart packaging.
Visitors to CPI’s site heard from industry experts in smart packaging and hybrid electronics and saw first-hand the capability that delivers this emerging technology, on a tour of the unique offering at CPI’s newest printable electronics facility.
Colleagues representing the NECOMADA project presented the support offered to the high speed roll-to-roll integration of hybrid and large area electronics.
Networking and group discussions throughout the day gave delegates the opportunity to meet with industry experts behind the successful projects presented, and to network with like-minded people in the printed electronics and packaging world.
The event culminated in a tour of CPI’s new facility which showed where and how the technology for smart packaging applications, and many others, takes place. This bespoke capability combines world-class equipment with technical expertise to create a unique offering:
- End-to-end process from design, to prototype, to scale-up
- Integration of sensor and electronic IoT connected inlays on a variety of flexible substrates to create reels inlays at high volume
- High speed printing using customised conductive inks and flexible adhesives, compatible with volume manufacture of hybrid and large area electronics.
- A converting line to integrate the inlays into smart labels or tags at high volume
Watch the new video and find out more about this capability: