News & Events

Date: 2018

NECOMADA project presents at CPI event, showcasing opportunities in smart packaging

NECOMADA project presents at CPI event, showcasing opportunities in smart packaging

Embracing Opportunities in Smart Packaging

Embracing Opportunities in Smart Packaging

Danish Technological Institute: Printed Electronics Conference

Danish Technological Institute: Printed Electronics Conference

E-18 Fair

innoLAE 2019

FachPack 2018

LOPEC 2019

Necomada Project Update – August 2018

New Ink and Adhesive Formulations to Reduce Cost of Internet of Things

New Ink and Adhesive Formulations to Reduce Cost of Internet of Things